Dynamic-mechanical analysis (DMA) was performed to investigate the viscoelastic response of multifunctional laminates for thermal energy storage (TES). The laminates were constituted by a microencapsulated paraffinic phase change material (PCM), a carbon fiber fabric, and an innovative reactive acrylic resin (Elium^®). In the Elium^®/PCM systems, the PCM fraction affected neither the glass transition temperature (\(T _{\mathrm{g}}\)) of the resin, found at 100–120 ^∘C, nor the activation energy of the glass transition, determined with multifrequency scans from the position of the \(\tan\delta \) peaks. On the other hand, the low-temperature (0–40 ^∘C) transition detected on the neat resin was hidden by the PCM melting, evidenced by a step in \(E'\) and peaks in \(E''\) and \(\tan \delta \). In the laminates, the amplitude of the \(E'\) step and the intensity of the \(\tan \delta \) peak associated to the PCM melting presented a linear correlation with the PCM content and the melting enthalpy. Cyclic heating/cooling DMA tests showed that the decrease in \(E'\) due to PCM melting was almost completely recovered (90–95%) upon crystallization. The difference between the \(\tan \delta \) peak positions on heating and on cooling decreased from 30 to 12 ^∘C when the heating/cooling rate changes from 3 to 1 ^∘C/min. Multifrequency tests highlighted that the activation energy of the glass transition of the laminates was lower than that of the matrices, and it did not follow a trend with the PCM fraction. Interestingly, also the \(E''\) and \(\tan \delta \) peaks related to PCM melting depended on the testing frequency, and their asymmetric shape could be interpreted by considering a progressive melting of the PCM in the microcapsules during heating.

进行了动态力学分析（DMA），以研究用于热能存储（TES）的多功能层压板的粘弹性响应。层压材料由微胶囊化的链烷烃相变材料（PCM），一个碳纤维织物，以及创新的反应性丙烯酸类树脂（Elium构成^®）。在Elium ^® / PCM系统中，PCM分数既不影响玻璃化转变温度（\（T _ {\ mathrm {G}} \）的树脂的），实测值在100-120  ^∘ C，也不的活化能玻璃化转变，通过多频扫描从\（\ tan \ delta \）峰的位置确定。另一方面，低温（  ^0–40∘C）通过PCM熔化隐藏了在纯树脂上检测到的转变，这由\（E'\）的台阶以及\（E''\）和\（\ tan \ delta \）的峰证明。在层压板中，与PCM熔化相关的\（E'\）步幅和\（\ tan \ delta \）峰的强度与PCM含量和熔化焓呈线性关系。循环加热/冷却DMA测试表明，由于PCM熔化而导致的\（E'\）降低在结晶后几乎完全得以恢复（90–95％）。加热和冷却时\（\ tan \ delta \）峰值位置之间的差异从30减少到 ^12∘当加热/冷却速率从3更改为^1∘C / min时达到 C。多频测试表明，层压板的玻璃化转变活化能低于基体的活化能，并且PCM分数未遵循趋势。有趣的是，与PCM熔化相关的\（E''\）和\（\ tan \ delta \）峰也取决于测试频率，并且它们的不对称形状可以通过考虑PCM在微囊中的逐步熔化来解释。加热。