The interfacial fracture toughness of sintered hybrid silver nanoparticles (AgNPs) on both Au and Cu substrates is studied as a function of sintering temperature. Interfacial microstructure and porosity evolution of Au/AgNPs and Cu/AgNPs are observed to impact the fracture toughness. An Au–Ag interfacial diffusion layer is resolved at the interface of Au/AgNPs interconnects, while an oxide layer is found at the interface of Cu/AgNPs interconnects. Both porosity and pore sizes of the sintered silver interconnects are analyzed across the micro- and macro-length scales and related to the interfacial fracture toughness. The experimental observations can be theoretically described, which permits to predict the fracture toughness of the sintered silver interconnects.

中文翻译：

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烧结混合银互连的界面断裂韧性

研究了 Au 和 Cu 基材上烧结的混合银纳米粒子 (AgNPs) 的界面断裂韧性作为烧结温度的函数。观察到 Au/AgNPs 和 Cu/AgNPs 的界面微观结构和孔隙度演变会影响断裂韧性。Au-Ag 界面扩散层在 Au/AgNPs 互连的界面处被解析，而氧化层在 Cu/AgNPs 互连的界面处被发现。在微观和宏观长度尺度上分析了烧结银互连件的孔隙率和孔径，并与界面断裂韧性相关。可以从理论上描述实验观察，这允许预测烧结银互连的断裂韧性。