Abstract

Due to the directions and environmental legislations from RoHS (Restrictions of Hazardous Substances), WEEE (World Electrical and Electronic Equipment) and from various countries, lead is banned from alloy making. Lead free solder alloys thus become very popular in electronic package industries. The research people around the globe started searching for new lead free solder alloys which can replace the Sn–Pb alloy. Many lead free solder alloys were identified. SAC alloys were very popular among this. The presence of 3 and 4% of Ag content adds the cost as well as threat were detected in the medical devices due to electrochemical migration. Sn–1Cu–1Ni–1Ag is a promising alloy with good mechanical properties. The corrosion behavior of the Sn–1Cu–1Ni–xAg (x = 0, 0.5, 1% by wt.) was studied in this paper using 3.5% by wt. NaCl solution. Microstructure analysis, EDAX analysis was also done. The results show that the corrosion rates were decreased with the addition of Ag. The corrosion rates for 7 days and 14 days were almost same. Combining the mechanical properties and corrosion resistance, Sn–1Cu–1Ni–1Ag is a promising lead free solder alloy.

中文翻译：

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Sn-1Cu-1Ni-xAg 无铅焊料在 3.5% NaCl 溶液中的腐蚀性能研究

摘要

由于 RoHS（有害物质限制）、WEEE（世界电气和电子设备）和各国的指示和环境立法，铅被禁止用于合金制造。因此，无铅焊料合金在电子封装行业变得非常流行。全球的研究人员开始寻找可以替代锡铅合金的新型无铅焊料合金。确定了许多无铅焊料合金。SAC合金在其中非常受欢迎。由于电化学迁移，3% 和 4% 的 Ag 含量的存在增加了成本以及在医疗设备中检测到的威胁。Sn-1Cu-1Ni-1Ag 是一种具有良好机械性能的有前途的合金。Sn–1Cu–1Ni– x Ag ( x= 0, 0.5, 1% wt.) 在本文中使用 3.5% wt. 进行了研究。氯化钠溶液。还进行了微观结构分析、EDAX分析。结果表明，随着Ag的加入，腐蚀速率降低。7 天和 14 天的腐蚀速率几乎相同。结合机械性能和耐腐蚀性，Sn-1Cu-1Ni-1Ag 是一种很有前途的无铅焊料合金。