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Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution

  • PHYSICOCHEMICAL PROBLEMS OF MATERIALS PROTECTION
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Abstract

Due to the directions and environmental legislations from RoHS (Restrictions of Hazardous Substances), WEEE (World Electrical and Electronic Equipment) and from various countries, lead is banned from alloy making. Lead free solder alloys thus become very popular in electronic package industries. The research people around the globe started searching for new lead free solder alloys which can replace the Sn–Pb alloy. Many lead free solder alloys were identified. SAC alloys were very popular among this. The presence of 3 and 4% of Ag content adds the cost as well as threat were detected in the medical devices due to electrochemical migration. Sn–1Cu–1Ni–1Ag is a promising alloy with good mechanical properties. The corrosion behavior of the Sn–1Cu–1Ni–xAg (x = 0, 0.5, 1% by wt.) was studied in this paper using 3.5% by wt. NaCl solution. Microstructure analysis, EDAX analysis was also done. The results show that the corrosion rates were decreased with the addition of Ag. The corrosion rates for 7 days and 14 days were almost same. Combining the mechanical properties and corrosion resistance, Sn–1Cu–1Ni–1Ag is a promising lead free solder alloy.

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This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

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  1. Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, 682022, Kerala, India

    S. Jayesh &  Jacob Elias

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  1. S. Jayesh
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  2. Jacob Elias
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Correspondence to S. Jayesh or Jacob Elias.

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Jayesh, S., Jacob Elias Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution. Prot Met Phys Chem Surf 57, 858–865 (2021). https://doi.org/10.1134/S2070205121040110

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  • DOI: https://doi.org/10.1134/S2070205121040110

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