The processing route has an influence on the damping capacity, and in this study, the influence of silicon carbide particle (SiCp) size on the damping capacity of AA6061 processed through friction stir processing was investigated. Specimens were extracted from the stir zone and analyzed for their damping properties, and the same was correlated with the obtained microstructures. The samples were also characterized for the change in dislocation density, plastic zone size, grain boundary area and crystallite size through x-ray diffraction and electron microscopy. The average grain size remarkably reduced after friction stir processing (45 to 5.64 μm) and it further decreased with an increase in reinforcement particle size (9, 29.4 and 109 µm). The damping capacity was measured through dynamic mechanical analyzer from 25 to 300°C and was observed to increase for the samples subjected to friction stir processing and with increasing particle size. It was found that the plastic zone radius around the SiC particle increased with the particle size, and the contribution of plastic zone was found to be significant than the dislocation density for damping below 125°C.

加工路线对阻尼能力有影响，本研究研究了碳化硅颗粒(SiCp)尺寸对搅拌摩擦加工AA6061的阻尼能力的影响。从搅拌区提取样品并分析其阻尼特性，并将其与获得的微观结构相关联。样品还通过 X 射线衍射和电子显微镜表征了位错密度、塑性区尺寸、晶界面积和微晶尺寸的变化。搅拌摩擦处理后平均晶粒尺寸显着减小（45 至 5.64 μm），并且随着增强颗粒尺寸（9、29.4 和 109 μm）的增加而进一步减小。阻尼能力是通过动态机械分析仪从 25 到 300°C 测量的，观察到经过搅拌摩擦处理的样品和颗粒尺寸的增加，阻尼能力增加。结果表明，SiC颗粒周围的塑性区半径随着粒径的增加而增加，并且发现塑性区的贡献比125°C以下阻尼时的位错密度显着。