Purpose

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability.

Design/methodology/approach

Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints.

Findings

The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC.

Originality/value

This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

中文翻译：

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Sn-5Sb-CuN​​iAg无铅焊料在铜基板上的润湿特性

目的

本文的目的是研究不同焊接工艺中 Sn-5Sb-CuN​​iAg 焊料在铜基板上的润湿行为以及合金元素对润湿性的影响。

设计/方法/方法

Sn-5Sb-CuN​​iAg 焊球（直径 750 µm）在 40 × 40 × 1 mm 的铜板上以不同的助焊剂、焊接温度和时间进行铺展和润湿。接触角由自制的测量仪器获得。在通过扫描电子显微镜分析之前对样品进行抛光和深度蚀刻。能量色散 X 射线光谱用于识别关节的成分。

发现

计算并阐述了不同焊接工艺和合金元素对Sn-5Sb-CuN​​iAg焊料在铜基体上润湿行为的影响。松香基助焊剂可以有效去除氧化层，提高Sn-5Sb-CuN​​iAg焊料的润湿性。然后随着焊接温度和时间的增加，接触角逐渐减小。适用于 Sn-5Sb-CuN​​iAg 焊料的焊接工艺为 RMA218、280°C 和 30 秒。考虑合金元素的影响，Sn-5Sb-0.5Cu-0.1Ni-0.5Ag对铜基体的润湿性较好。此外，Ni 会在焊料/Cu 界面处积累并形成锯齿状的 (Cu,Ni)6Sn5 IMC。

原创性/价值

这项工作是使用我们手工制作的实验设备进行的，用于润湿测试的五元无铅焊料合金的生产属于我们。所研究的 Sn-5Sb-CuN​​iAg 合金具有较高的熔点和较好的润湿性，是高温无铅焊料替代高铅焊料的候选材料之一，并适用于第三代高温高频工作环境。一代半导体元件，具有更大的潜在研发价值。