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Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Xiuqi Wang (State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, China)
Fenglian Sun (Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin, China)
Bangyao Han (Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin, China)
Yilun Cao (Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin, China)
Jinyang Du (Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin, China)
Long Shao (Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin, China)
Guohuai Liu (State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 23 August 2021

Issue publication date: 17 February 2022

153

Abstract

Purpose

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability.

Design/methodology/approach

Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints.

Findings

The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC.

Originality/value

This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Keywords

Citation

Wang, X., Sun, F., Han, B., Cao, Y., Du, J., Shao, L. and Liu, G. (2022), "Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate", Soldering & Surface Mount Technology, Vol. 34 No. 2, pp. 96-102. https://doi.org/10.1108/SSMT-01-2021-0001

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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