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Mechanical, electrical and thermal properties of HfC-HfB2-SiC ternary eutectic composites prepared by arc melting
Journal of the European Ceramic Society ( IF 5.8 ) Pub Date : 2021-07-06 , DOI: 10.1016/j.jeurceramsoc.2021.07.003
Qizhong Li 1, 2 , Zhangpeng Meng 1 , Bing Xiao 1 , Jiaojiao Li 1 , Kai Liu 3 , Meijun Yang 4 , Song Zhang 1 , Takashi Goto 1, 5 , Rong Tu 1, 6, 7
Affiliation  

HfC-HfB2-SiC composites were prepared by arc melting using HfC, HfB2 and SiC powder as raw materials. The ternary eutectic composition of 16HfC-17HfB2-67SiC (mol%) was first identified, showing a complicated maze microstructure of HfC, HfB2 and SiC approximately 500 nm in thickness. The eutectic temperature of the HfC-HfB2-SiC composite was nearly 2760 K. The Vickers hardness and fracture toughness of the HfC-HfB2-SiC ternary eutectic composite were 20.8 GPa and 7.7 MPa m1/2, respectively. With increasing temperature from 300 to 800 K, the electrical conductivity decreased from 8.8 × 105 to 4.3 × 105 Sm−1, whereas the thermal conductivity increased from 28 to 32 W m−1 K−1.



中文翻译:

电弧熔炼制备的HfC-HfB2-SiC三元共晶复合材料的机械、电学和热学性能

以HfC、HfB 2和SiC粉为原料,通过电弧熔炼制备了HfC-HfB 2 -SiC复合材料。16HfC-17HfB 2 -67SiC (mol%)的三元共晶成分首先被确定,显示出厚度约为 500 nm的 HfC、HfB 2和 SiC的复杂迷宫微观结构。HfC-HfB 2 -SiC 复合材料的共晶温度接近 2760 K。HfC-HfB 2 -SiC 三元共晶复合材料的维氏硬度和断裂韧性分别为 20.8 GPa 和 7.7 MPa m 1/2。随着温度从 300 升高到 800 K,电导率从 8.8 × 10 5下降到 4.3 × 10 5 Sm-1,而热导率从 28 W m -1 K -1增加到 32 W m -1 K -1

更新日期:2021-08-27
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