Hot compression deformation behavior of the Cu-0.45Cr-1.0Ni-0.28Si-0.14Co alloy was studied by a thermal-mechanical simulator at strain rates of 0.001–1 s⁻¹ and deformation temperatures of 700–900°C. The microstructure and texture of the copper alloy after the hot compression deformation were investigated. The results showed that the flow behavior of the Cu-Cr-Ni-Si-Co alloy was significantly affected by the deformation temperature and strain rate. The typical dynamic recrystallization (DRX) occurred at high temperatures and low strain rates, while the typical dynamic recovery (DRV) appeared at low temperatures and high strain rates. When the deformation temperature increased from 700°C to 900°C, a transition from copper and S texture to gross texture was found. The value of hot deformation activation energy (Q) was calculated as 330.87 kJ/mol. The optimized hot deformation parameters for the Cu-Cr-Ni-Si-Co alloy were 800–850°C/0.01–0.1 s⁻¹.

Cu-0.45Cr-1.0Ni-0.28Si-0.14Co 合金的热压缩变形行为通过热机械模拟器在 0.001-1 s ^{-1 的}应变速率和 700-900°C 的变形温度下进行研究。研究了热压缩变形后铜合金的显微组织和织构。结果表明，Cu-Cr-Ni-Si-Co合金的流动行为受变形温度和应变速率的影响显着。典型的动态再结晶（DRX）发生在高温和低应变率下，而典型的动态回复（DRV）发生在低温和高应变率下。当变形温度从 700°C 增加到 900°C 时，发现了从铜和 S 织构到粗织构的转变。热变形活化能值（Q ) 计算为 330.87 kJ/mol。Cu-Cr-Ni-Si-Co 合金的优化热变形参数为 800-850°C/0.01-0.1 s ^-1。