The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ${}^{\circ }$C and full melting is completed at 405 ${}^{\circ }$C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi₂ and Bi₉Ti₈ are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi₂. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

中文翻译：

---

Bi-Ag-Ti型钎焊合金的表征及硅铜的超声钎焊研究

研究工作的目的是表征Bi-Ag-Ti型钎焊合金并研究硅和铜的直接钎焊。Bi11Ag1.5Ti焊料的熔化间隔很宽。其范围主要取决于银和钛的含量。焊料在262.5的温度下开始熔化${}^{\circ }$C，在405处完成完全熔化 ${}^{\circ }$C.焊料的微观结构由具有局部共晶的铋基质组成。银晶体和钛相BiBi ₂和Bi ₉ Ti ₈偏析在基体中。焊料的平均抗拉强度在42 MPa左右变化。由于活性钛与反应层形成时硅与硅表面的相互作用而形成了与硅的键合，该反应层由新产品TiSi _2组成。在铜/焊料的边界中，液态铋焊料与铜基板之间发生相互作用，并通过共晶反应得到支持。在Bi和Cu方面，液态铋焊料之间的互溶性都非常有限。在用Bi11Ag1.5Ti焊料制造的Si / Cu组合接头的情况下，平均剪切强度为43 MPa。