In the nanoscale regime, carbon nanotubes (CNTs) are being considered as a future alternative interconnect material for traditional copper (Cu) wires in integrated circuit technology. The advances in device scaling and the continuous increase of clock frequencies in very large-scale integration technology have resulted in signal integrity (SI) issues. The reduction of such SI issues in coupled multiwalled CNT bundle interconnects is evaluated herein. The worst-case crosstalk delay and peak noise voltage are simulated for three-line coupled interconnects at the 22-nm technology node. To minimize the crosstalk effects, a passive shielding technique is proposed, resulting in reductions of 15.3% and 40.8% in the dynamic in-phase and out-phase crosstalk condition, respectively. The SI of single- and two-line coupled MWCNT bundle interconnects is also investigated based on eye diagrams in a channel simulator and compared with that of Cu interconnects. The eye-opening height is significantly enhanced in the MWCNT bundle and Cu interconnects when using the proposed technique. Moreover, the MWCNT bundle has a higher eye-opening compared with its Cu counterpart.

在纳米范围内，碳纳米管（CNT）被视为集成电路技术中传统铜（Cu）线的未来替代互连材料。在超大规模集成技术中，器件缩放的发展以及时钟频率的不断提高已导致信号完整性（SI）问题。本文评估了耦合的多壁CNT束互连中此类SI问题的减少。针对22纳米技术节点处的三线耦合互连，模拟了最坏情况下的串扰延迟和峰值噪声电压。为了最小化串扰，提出了一种无源屏蔽技术，可在动态同相和异相串扰条件下分别降低15.3％和40.8％。还基于通道模拟器中的眼图研究了单线和两线耦合MWCNT束互连的SI，并将其与Cu互连进行了比较。使用所提出的技术时，在MWCNT束和Cu互连中，睁眼高度显着提高。此外，MWCNT束与其铜对应物相比具有更高的睁眼度。