Abstract

Silver is electroplated on the surface of connectors as a protective barrier layer in order to improve the corrosion resistance and to increase the durability of the connector. In this work, silver-graphene films were electrodeposited on copper–zinc alloy substrates from a succinimide silver-plating system in Hull-cell alkaline solutions by the addition of 0.4 g L^–1 graphene oxide. The crystallographic structure and microstructure of the formed films were determined by X-ray diffraction and scanning electron microscopy, respectively. The corrosion resistance of the films was measured by a potentiodynamic polarization test. The results show that a low amount of graphene was incorporated into a silver deposit. The addition of graphene oxide could not influence the deposition rate and the crystallographic structure of the film, but resulted in a decrease in the size of aggregates or particles, compared with those of a pure silver film. The optimal current density was found to be 0.5 ~ 1.0 A dm^–2, the surface of the films had a homogeneous close-packed fine-crystalline structure. The films were uniform, dense, and adherent to the substrate, without any evidence of delamination. At the same time, the addition of graphene oxide improved the corrosion resistance of silver films to a certain extent.

中文翻译：

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琥珀酰亚胺溶液中用于电子连接器的银-石墨烯薄膜的电沉积

摘要

银被电镀在连接器的表面上作为保护性阻挡层，以提高耐腐蚀性并增加连接器的耐用性。在这项工作中，通过添加0.4 g L ^–1，在赫尔电池碱性溶液中，通过琥珀酰亚胺镀银系统将银-石墨烯膜电沉积在铜-锌合金基底上氧化石墨烯。形成的膜的晶体结构和显微结构分别通过X射线衍射和扫描电子显微镜确定。膜的耐腐蚀性通过电位动力学极化试验测量。结果表明，少量的石墨烯被掺入到银沉积物中。与纯银膜相比，氧化石墨烯的添加不会影响膜的沉积速率和晶体结构，但是会导致聚集体或颗粒的尺寸减小。发现最佳电流密度为0.5〜1.0 A dm ^–2，膜的表面具有均匀的紧密堆积的微晶结构。薄膜均匀，致密并粘附在基材上，没有任何分层迹象。同时，氧化石墨烯的加入在一定程度上提高了银膜的耐蚀性。