Abstract

The design and technology of solder and adhesive bonds, as well as the elastic strength and plastic properties of the materials of a Si crystal, solder, and glue joint, are the most significant factors characterizing the reliability and durability of a microelectronic module. The structure proposed in this paper is designed to reduce its weight and size characteristics, improve reliability, and ensure efficient heat dissipation. When simulating the stress-strain state of microconnections in the microelectronic module, it is discovered that, when using a stannum-bismuth (SnBi) solder, the stresses in the assembly materials are distributed more uniformly and their values are significantly lower than those when using SnPb and SnZn solders: in silicon by 5–30% and in a copper conductor by 20–90%. It is determined that, under operating conditions and tests at elevated temperatures, the stresses in the SnBi solder are lower by factor of 1.5 and 2.2 than those in the SnPb and SnZn solders, respectively. It is shown that the cold-cure epoxy glue used has good adhesion to various structural materials and is durable with the corresponding technological process being characterized by low labor intensity. The rational thickness of the glue joint (50–200 μm) and copper conductor (20 μm) is determined. Some recommendations for the design of microconnections in microelectronic modules are made.

中文翻译：

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微电子模块中元件连接的热机械强度

摘要

焊料和粘接剂的设计和技术，以及硅晶体，焊料和胶接点的材料的弹性强度和塑性，是表征微电子模块可靠性和耐用性的最重要因素。本文提出的结构旨在减轻其重量和尺寸特性，提高可靠性并确保有效的散热。在微电子模块中模拟微连接的应力-应变状态时，发现使用锡-铋（SnBi）焊料时，组装材料中的应力分布更均匀，并且其值明显低于使用时的应力值。 SnPb和SnZn焊料：硅中含量为5％至30％，铜导体中含量为20％至90％。确定，在工作条件和高温下的测试中，SnBi焊料的应力分别比SnPb和SnZn焊料的应力低1.5倍和2.2倍。结果表明，所使用的冷固化环氧胶对各种结构材料具有良好的附着力，并且经久耐用，相应的工艺过程具有劳动强度低的特点。确定胶接点（50–200μm）和铜导体（20μm）的合理厚度。针对微电子模块中的微连接设计提出了一些建议。结果表明，所使用的冷固化环氧胶对各种结构材料具有良好的附着力，并且经久耐用，相应的工艺过程具有劳动强度低的特点。确定胶接点（50–200μm）和铜导体（20μm）的合理厚度。针对微电子模块中的微连接设计提出了一些建议。结果表明，所使用的冷固化环氧胶对各种结构材料具有良好的附着力，并且经久耐用，相应的工艺过程具有劳动强度低的特点。确定胶接点（50–200μm）和铜导体（20μm）的合理厚度。针对微电子模块中的微连接设计提出了一些建议。