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Thermomechanical Strength of Element Connections in Microelectronic Modules

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Abstract

The design and technology of solder and adhesive bonds, as well as the elastic strength and plastic properties of the materials of a Si crystal, solder, and glue joint, are the most significant factors characterizing the reliability and durability of a microelectronic module. The structure proposed in this paper is designed to reduce its weight and size characteristics, improve reliability, and ensure efficient heat dissipation. When simulating the stress-strain state of microconnections in the microelectronic module, it is discovered that, when using a stannum-bismuth (SnBi) solder, the stresses in the assembly materials are distributed more uniformly and their values are significantly lower than those when using SnPb and SnZn solders: in silicon by 5–30% and in a copper conductor by 20–90%. It is determined that, under operating conditions and tests at elevated temperatures, the stresses in the SnBi solder are lower by factor of 1.5 and 2.2 than those in the SnPb and SnZn solders, respectively. It is shown that the cold-cure epoxy glue used has good adhesion to various structural materials and is durable with the corresponding technological process being characterized by low labor intensity. The rational thickness of the glue joint (50–200 μm) and copper conductor (20 μm) is determined. Some recommendations for the design of microconnections in microelectronic modules are made.

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REFERENCES

  1. Simonov, B.M., Britkov, O.M., and Timoshenkov, A.S., Konstruktsii i tekhnologii izgotovleniya komponentov i uzlov elektronnykh sredstv: ucheb. posobie (Designs and Manufacturing Technology of Components and Units of Electronic Means), Timoshenkov, S.P., Ed., Moscow: MIET, 2018.

    Google Scholar 

  2. Kuznetsov, O.A., Pogalov, A.I., and Sergeev, V.S., Prochnost’ elementov mikroelektronnoi apparatury (The Strength of the Elements of Microelectronic Equipment), Moscow: Radio Svyaz’, 1990.

  3. Pitsyk, V.S., Murav’ev, V.I., Sablin, P.A., and Evstigneev, A.I., Method for calculating the area of physical contact in the manufacture of permanent joints in tight fit, in Metallurgiya: tekhnologii, innovatsii, kachestvo (Metallurgy: Technology, Innovation, Quality, Collection of Articles), Protopopov, E.V., Ed., Novokuznetsk: SibGIU, 2015, pp. 194–200.

  4. Spravochnik po paike (Soldering Reference Book), Petrunin, I.E., Ed., Moscow: Mashinostroenie, 2003.

    Google Scholar 

  5. Antipov, Yu.V., Babaevskii, P.G., Borodai, F.Ya., et al., Non-metallic structural materials, in Mashinostroenie: entsiklopediya (Mechanical Engineering: Encyclopedia), Kul’kov, A.A., Ed., Moscow: Mashinostroenie, 2005, Vol. II-4.

  6. Kopaev, B.V. and Andreeva, L.P., Plastic deformation of soldered seam of lap joint, Zagot. Pr-va Mashinostr., 2016, no. 6, pp. 7–12.

  7. Andreeva, L.P. and Kopaev, B.V., Influence of material thickness on strength of soldered lap joint, Zagot. Pr-va Mashinostr., 2016, no. 12, pp. 15–17.

  8. Polyanskii, A.M. and Polyanskii, V.M., Strength and fracture of brazed joint as indicator of quality of brazing connection, Svarka Diagn., 2014, no. 3, pp. 57–60.

  9. Ivashko, A.I. and Krymko, M.M., The influence of solder materials on the parameters of power semiconductor devices, Elektron. Tekh., Ser. 2: Poluprovodn. Prib., 2016, no. 3 (242), pp. 14–20.

  10. Pogalov, A.I., Grushevskii, A.M., Blinov, G.A., and Titov, A.Yu., Thermo-mechanical durability of materials for soldered connections of multicrystal modules, Izv. Vyssh. Uchebn. Zaved., Elektron., 2009, no. 6 (80), pp. 3–9.

  11. Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Modeling of adhesive-bonded joints to ensure reliability of three-dimensional microelectronic modules, Izv. Vyssh. Uchebn. Zaved., Elektron., 2018, vol. 23, no. 1, pp. 23–31.

    Google Scholar 

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Authors and Affiliations

  1. National Research University of Electronic Technology, Moscow, Russia

    A. I. Pogalov, A. Yu. Titov & S. P. Timoshenkov

Authors
  1. A. I. Pogalov
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  2. A. Yu. Titov
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  3. S. P. Timoshenkov
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Correspondence to A. I. Pogalov.

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Translated by Yu. Kornienko

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Pogalov, A.I., Titov, A.Y. & Timoshenkov, S.P. Thermomechanical Strength of Element Connections in Microelectronic Modules. Russ Microelectron 49, 489–493 (2020). https://doi.org/10.1134/S1063739720070082

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  • DOI: https://doi.org/10.1134/S1063739720070082

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