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Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode
Welding in the World ( IF 2.4 ) Pub Date : 2021-01-20 , DOI: 10.1007/s40194-021-01066-7
He Zhang , Shang Wang , Chunjin Hang , Yanhong Tian

Copper nanowire (CuNW) has been considered as one of the most promising materials to replace ITO for transparent electrode (TE). However, the loose connections and oxidation problem limited its practical usage. Herein, we introduced a facile and simple electrodeposition method to solve these problems, which can effectively join the stacked NWs together and improve the oxidation resistance. After electrodeposition of Ag layer, the sheet resistance decreased to 13.8 Ohm/sq. at a transmittance of 90.5%. Thanks to the forming of firm joints, the relative resistance kept stable after 1000 times cyclic bending. Compared with pristine TE that the electrical conductivity increased 10 times under the atmosphere ambient, the electrical conductivity nearly unchanged after electrodepositing Ag layer under the same condition. The peaks of copper oxides are not observed in the XPS spectrum, proving the Ag layer prevents the contact between CuNWs and oxygen element. At last, a flexible and transparent heater was fabricated based on these advantages, which can produce uniform heating under a low input voltage.



中文翻译:

通过电沉积银层连接铜纳米线,以形成高性能透明电极

铜纳米线(CuNW)被认为是最有希望替代透明电极(TE)的ITO的材料之一。然而,松散的连接和氧化问题限制了其实际使用。在此,我们引入了一种简便而简单的电沉积方法来解决这些问题,该方法可以有效地将堆叠的NW连接在一起并提高抗氧化性。电沉积Ag层后,薄层电阻降至13.8 Ohm / sq。透射率为90.5%。由于形成了牢固的接头,在经过1000次循环弯曲后,相对电阻保持稳定。与原始TE相比,在大气环境下电导率提高了10倍,在相同条件下电沉积Ag层后,电导率几乎没有变化。在XPS光谱中未观察到氧化铜的峰,证明Ag层阻止了CuNWs和氧元素之间的接触。最后,基于这些优点制造了柔性透明加热器,可以在低输入电压下产生均匀的加热。

更新日期:2021-01-21
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