The effects of postprocessing annealing at 225 °C for 2 h on the creep properties of AlSi10Mg alloy were investigated through constant load experiments carried out at 150 °C, 175 °C and 225 °C. In the range of the experimental conditions here considered, the annealing treatment resulted in an increase in minimum creep rate for a given stress. The reduction in creep strength was higher at the lowest temperature, while the effect progressively vanished as temperature increased and/or applied stress decreased. The minimum creep rate dependence on applied stress was modeled using a physically-based model which took into account the ripening of Si particles at high temperature and which had been previously applied to the as-deposited alloy. The model was successfully validated, since it gave an excellent description of the experimental data.

中文翻译：

---

低温退火对增材制造AlSi10Mg合金蠕变性能的影响：实验与模型

通过在150°C，175°C和225°C下进行的恒定载荷实验研究了225°C下2 h的后处理退火对AlSi10Mg合金蠕变性能的影响。在此处考虑的实验条件范围内，退火处理导致了给定应力下最小蠕变速率的增加。蠕变强度的降低在最低温度下更高，而随着温度的升高和/或施加的应力的降低，其影响逐渐消失。使用基于物理的模型对最小蠕变速率对施加应力的依赖性进行了建模，该模型考虑了高温下Si粒子的熟化，并且先前已将其应用于沉积合金。该模型已成功验证，因为它可以很好地描述实验数据。