The effect of dry grinding on 304L stainless steel’s passive behavior is compared to two other surface finishing (mechanical polishing down to 2400 with SiC emery paper and 1 µm with diamond paste, respectively). The characterization of the surface state was performed using scanning electron microscopy, transmission electron microscopy, 3D optical profilometer, and X-ray diffraction. Results indicate that each surface treatment leads to different surface states. The ground specimens present an ultrafine grain layer and a strong plastic deformation underneath the surface, while an ultrafine grain layer characterizes the subsurface of the polished specimens. Grinding induces high residual compressive stresses and high roughness compared to polishing. The characterization of the passive films was performed by electrochemical impedance spectroscopy and Mott–Schottky analysis. The study shows that the semiconductor properties and the thickness of the passive films are dependent on the surface state of the 304L stainless steel.

中文翻译：

---

机械表面处理对304L不锈钢表面状态和钝化行为的影响

将干磨对304L不锈钢的钝化行为的影响与其他两个表面处理（分别用SiC砂纸机械抛光至2400和用金刚石糊剂机械抛光至1 µm）进行了比较。使用扫描电子显微镜，透射电子显微镜，3D光学轮廓仪和X射线衍射对表面状态进行表征。结果表明，每种表面处理都会导致不同的表面状态。磨碎的试样在表面下呈现出超细晶粒层和强烈的塑性变形，而超细晶粒层则表征了抛光试样的亚表面。与抛光相比，磨削会产生较高的残余压应力和较高的粗糙度。钝化膜的表征通过电化学阻抗谱和Mott–Schottky分析进行。研究表明，钝化膜的半导体性能和厚度取决于304L不锈钢的表面状态。