Thermo-physical properties of hollow glass microsphere (HGM) filled silicone resin are analyzed by various mathematical models to optimize the formulation for a low-density high-temperature resistant composite. The study involves analyzing effective thermal conductivity, specific heat, and density for a two-phase particulate composite system by using the most popular expressions available in the literature at various volume fractions of HGM in the silicone resin matrix. Experiments are performed to compare theoretical results with the experimental data and identified the preferred composition with a density as low as 0.39 g/cc and thermal conductivity 0.116 W/m-K. The microstructural studies by SEM are done to explain the deviation in experimental and theoretical results. FEM analysis is done to understand the heat flow phenomenon in HGM filled silicone composites.

通过各种数学模型分析了中空玻璃微球（HGM）填充的有机硅树脂的热物理性质，以优化低密度耐高温复合材料的配方。该研究涉及通过使用文献中在有机硅树脂基质中HGM的各种体积分数下使用的最受欢迎的表达式，分析两相颗粒复合系统的有效导热率，比热和密度。进行实验以将理论结果与实验数据进行比较，并确定了密度低至0.39 g / cc和热导率0.116 W / mK的优选组合物。SEM进行了微观结构研究，以解释实验和理论结果的偏差。