Abstract

The use of a pulse picosecond laser with a wavelength of 532 nm and frequency of 15 Hz in the formation of holes with diameters up to 0.1 mm in nonmetallic substrates (silicon, ceramics, etc.) was proposed. It was found by modeling in MathCAD and COMSOL Multiphysics that the half-angle value of the light cone aperture that depends on the focusing of laser radiation exerts a significant effect on the depth and diameter of holes in laser processing. The influence of the regimes of laser processing employing nanosecond and picosecond lasers with wavelengths of 1064 and 532 nm, respectively, on the conicity and time of formation of holes in silicon substrates was investigated. The preliminary heating of the substrate to 170–200°С reduces the time of formation of the holes by 20%.

中文翻译：

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非金属基板上的孔的激光形成

摘要

提出了在非金属衬底（硅，陶瓷等）中形成直径最大为0.1 mm的孔时使用波长为532 nm，频率为15 Hz的脉冲皮秒激光的方法。通过在MathCAD和COMSOL Multiphysics中进行建模发现，取决于激光辐射聚焦的光锥孔径的半角值会对激光加工中孔的深度和直径产生重大影响。研究了分别使用1064和532 nm波长的纳秒和皮秒激光器进行激光加工的方式对硅衬底中孔的锥度和形成时间的影响。将基材初步加热到170–200°С，可将孔的形成时间减少20％。