Ferric chloride (FeCl₃) has widespread use as an etchant in the PCB industry and for photochemical machining. Although the corrosion process of copper in FeCl₃ is well known, the use of organic inhibitors of copper corrosion in FeCl₃ solutions has not been reported. Such inhibition may allow microfabrication of special PCB designs and electrochemical sensors. Here, we investigate the inhibition of copper corrosion by FeCl₃ (0.10 or 2.46 M) solutions with organic inhibitors. The most promising inhibitors are identified, investigated in 0.01 M FeCl₃ solution using electrochemical techniques at different temperatures and exposure times, and the modified surfaces of copper are characterized by a variety of techniques in order to determine the inhibition mechanism. 5-methyl-1H-benzotriazole (MBTA, 65 mM) and 1H-benzotriazole (BTA, 65 mM) are found to be the most attractive inhibitors, with inhibition efficiencies between 96.5% and 99.5% at room temperature, depending on the exposure time and the measurement technique.

氯化铁（FeCl ₃）在PCB工业和光化学加工中已广泛用作蚀刻剂。尽管FeCl ₃中铜的腐蚀过程是众所周知的，但尚未报道在FeCl ₃溶液中使用铜腐蚀的有机抑制剂。这种抑制可以允许特殊的PCB设计和电化学传感器的微细加工。在这里，我们研究了使用有机抑制剂的FeCl ₃（0.10或2.46 M）溶液对铜腐蚀的抑制作用。确定了最有希望的抑制剂，并在0.01 M FeCl _{3中进行了研究}在不同的温度和暴露时间下使用电化学技术处理铜溶液，并通过多种技术对铜的改性表面进行表征，以确定其抑制机理。发现5-甲基-1H-苯并三唑（MBTA，65 mM）和1H-苯并三唑（BTA，65 mM）是最有吸引力的抑制剂，根据暴露时间的不同，在室温下的抑制效率在96.5％至99.5％之间。和测量技术。