A combination of metal and non-metal filler in an epoxy resin, called a hybrid electrically conductive adhesive (ECA), is an important development in the field of highly conductive electronic interconnect materials. Carbon nanotubes (CNTs) are well known for contributing strength and stiffness to ECA and silver (Ag) has been widely used as a conductive metal. This study presents the characterization of a hybrid silver micro-flake (AgMF) with multiwalled carbon nanotubes (MWCNT) in an epoxy matrix ECA, in terms of electrical and mechanical properties. The weight percentage of AgMF used was varied, from 1 wt.% to 10 wt.%, whereas the weight percentage of MWCNT filler loading was maintained at 5 wt.%. The properties of the hybrid ECA were characterized using a four-point probe and a universal testing machine for lap shear tests. It was found that the filler hybridization lowered the performance of the ECA in terms of both electrical and mechanical properties, as compared with non-hybrid MWCNT-filled ECA. This may be attributed to the weak interaction between micro- and nano-filler particle sizes and agglomeration of the MWCNT in the epoxy matrix in the hybrid ECA system. The hybrid ECA electrical conductivity was successfully enhanced when a low ratio of AgMF and MWCNT was considered. In addition, failure analysis confirmed that the hybrid ECA with less AgMF filler loading exhibits improved adhesion strength, suggesting a superior epoxy-to-substrate bonding interface.

环氧树脂中金属和非金属填料的组合（称为混合导电胶（ECA））是高导电性电子互连材料领域的重要发展。众所周知，碳纳米管（CNTs）有助于提高ECA的强度和刚度，而银（Ag）已被广泛用作导电金属。这项研究从电气和机械性能方面介绍了在环氧基质ECA中具有多壁碳纳米管（MWCNT）的杂化银微片（AgMF）的特性。使用的AgMF的重量百分比在1重量％至10重量％之间变化，而MWCNT填料负载的重量百分比保持在5重量％。使用四点探针和用于搭接剪切测试的通用测试机对混合ECA的特性进行了表征。发现与非混合MWCNT填充的ECA相比，填料杂交降低了ECA在电气和机械性能方面的性能。这可能归因于混合ECA系统中微米级和纳米级填料粒径之间的弱相互作用以及环氧基体中MWCNT的团聚。当考虑低比例的AgMF和MWCNT时，混合ECA的电导率可以成功提高。此外，失效分析证实，具有较少AgMF填充量的混合ECA表现出更高的粘合强度，表明了优异的环氧树脂与基材的粘合界面。这可能归因于混合ECA系统中微米级和纳米级填料粒径之间的弱相互作用以及环氧基体中MWCNT的团聚。当考虑低比例的AgMF和MWCNT时，混合ECA的电导率可以成功提高。此外，失效分析证实，具有较少AgMF填充量的混合ECA表现出更高的粘合强度，表明了优异的环氧树脂与基材的粘合界面。这可能归因于混合ECA系统中微米级和纳米级填料粒径之间的弱相互作用以及环氧基体中MWCNT的团聚。当考虑低比例的AgMF和MWCNT时，混合ECA的电导率可以成功提高。此外，失效分析证实，具有较少AgMF填充量的混合ECA表现出更高的粘合强度，表明了优异的环氧树脂与基材的粘合界面。