This research highlights the influence of bonding pressure on the features of diffusion-bonded joints (DBJs) between Ti6Al4V alloy and TiAlNb alloy investigated at 900 °C for 120 minutes in vacuum with variable pressures of 0.5, 1, 2, 3, and 4 MPa. Characterization of the bonded interfaces was conducted using optical microscopy and scanning electron microscopy in backscattered mode. A molecular dynamics (MD) model was developed with the commercial Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) package utilizing second nearest neighbor modified embedded atom method (2NN MEAM) potentials to predict the diffusion mechanism with variable compressive pressures along the TiAlNb|Ti6Al4V joint interface. Microstructural characterization with light microscopy and scanning electron microscopy in back-scattered mode (SEM-BSE) along the TiAlNb|Ti6Al4V DBJs revealed no interfacial intermetallic phase nucleation. Energy dispersive spectroscopy (EDS) maps and line profiles helped to understand composition variation across the interface. The maximum joint tensile strength of ~ 875 MPa, ~ 13.1% elongation, and mass diffusivity on both sides were obtained at 4 MPa processing pressures with a significant tendency of diffusivity improvement in the TiAlNb side.

这项研究突出了在真空，压力为0.5、1、2、3和4 MPa的条件下，在900°C下120分钟下研究的粘结压力对Ti6Al4V合金和TiAlNb合金之间的扩散粘结接头（DBJ）的特征的影响。 。使用光学显微镜和扫描电子显微镜以反向散射模式对结合界面进行表征。使用商业大型原子/分子大规模并行模拟器（LAMMPS）软件包开发了分子动力学（MD）模型，该模型利用第二近邻修饰嵌入原子方法（2NN MEAM）势预测了可变压缩压力沿TiAlNb的扩散机理| Ti6Al4V联合接口。沿TiAlNb | Ti6Al4V DBJ的反向散射模式（SEM-BSE）的光学显微镜和扫描电子显微镜的显微结构表征显示，没有界面金属间相成核。能量色散光谱（EDS）图和线轮廓有助于了解整个界面上的成分变化。在4 MPa的加工压力下，获得的最大接头抗拉强度约为875 MPa，伸长率约为13.1％，并且两侧的质量扩散率均具有明显的提高TiAlNb侧扩散率的趋势。