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Temperature-dependent resistive switching for gold/poly(methyl methacrylate)/heavily doped p-type Si/indium devices by incorporating black phosphorus into poly(methyl methacrylate)
Indian Journal of Physics ( IF 2 ) Pub Date : 2020-08-05 , DOI: 10.1007/s12648-020-01818-z
Ting-Hong Su , Ming-Yang Chen , Wei-Shiuan Huang , Yow-Jon Lin

This study determines the effect of incorporating black phosphorus (BP) nanosheets into poly(methyl methacrylate) (PMMA) on resistive switching (RS) mechanisms using the temperature-dependent current–voltage characteristics of gold/PMMA:BP/heavily doped p-type Si (p+-Si)/indium devices. A gold/PMMA:BP/p+-Si/indium device exhibits RS behavior, but a gold/PMMA/p+-Si/indium device exhibits set/reset–free current–voltage characteristics. The current in gold/PMMA:BP/p+-Si/indium devices is limited by ohmic conduction, the space charge or filled trap. Incorporating BP into PMMA results in a significant increase in the trap density for a PMMA:BP film, which increases the RS performance for gold/PMMA:BP/p+-Si/indium devices.



中文翻译:

通过将黑磷掺入聚甲基丙烯酸甲酯中,对金/聚甲基丙烯酸甲酯/重掺杂p型Si /铟器件进行随温度变化的电阻转换

本研究确定在电阻开关并入黑磷(BP)纳米片为聚(甲基丙烯酸甲酯)(PMMA)(的效果- [R小号使用金/ PMMA的依赖于温度的电流-电压特性)的机制:BP /重掺杂p Si(p + -Si)/铟器件。金/ PMMA:BP / p + -Si /铟器件表现出R S行为,而金/ PMMA / p + -Si /铟器件表现出置位/复位-自由电流-电压特性。金/ PMMA:BP / p + -Si /铟器件中的电流受到欧姆传导,空间电荷或填充陷阱的限制。将BP掺入PMMA会导致PMMA:BP膜的陷阱密度显着增加,这会增加金/ PMMA:BP / p + -Si /铟器件的R S性能。

更新日期:2020-08-05
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