Cu etchant solutions have been widely used in etching processes because of their high etching efficiency and low cost for manufacturing electric products. Hydrogen peroxide (H₂O₂), a major components of Cu etchants, is known for its instability and reactivity under thermal induction, metal-ion catalysis, or pyrolysis; thus, Cu etchants have a higher risk of thermal explosion than other etchant solutions do. In this study, the exothermic reaction of the Cu etchant was initiated at approximately 70 °C, and the exothermic enthalpy (ΔH) of the first peak was measured to be approximately 274.4 J g⁻¹ using differential scanning calorimetry 1 (DSC1). The American Society for Testing and Materials (ASTM)—Ozawa/Kissinger method, and Advanced Kinetics and Technology Solutions (AKTS)—Friedman simulation, were used to calculate the reaction kinetics. Thermal runaway and gas evolution were evaluated through vent sizing package 2 (VSP2). The pressure of the Cu etchant surged from atmospheric pressure to a maximum pressure of 225.075 psig, with a pressure increase of 168.684 psig min⁻¹ in the VSP 2 adiabatic test. Finally, to improve the safety operation during the etching process, thermokinetic analysis was used to identify appropriate kinetic parameters for the thermal decomposition of the Cu etchant.

铜蚀刻剂溶液由于其高蚀刻效率和制造电子产品的低成本而被广泛用于蚀刻工艺中。Cu腐蚀剂的主要成分过氧化氢（H ₂ O ₂）以其在热感应，金属离子催化或热解下的不稳定性和反应活性而著称。因此，铜蚀刻剂比其他蚀刻剂溶液具有更高的热爆炸风险。在这项研究中，Cu蚀刻剂的放热反应在大约70°C时开始，测得第一个峰的放热焓（ΔH）约为274.4 J g ^-1使用差示扫描量热法1（DSC1）。使用美国材料试验学会（ASTM）的Ozawa / Kissinger方法以及高级动力学和技术解决方案（AKTS）的Friedman模拟来计算反应动力学。通过排气口尺寸套件2（VSP2）评估了热逸散和气体逸出。在VSP 2绝热测试中，Cu蚀刻剂的压力从大气压升至225.075 psig的最大压力，并且压力增加168.684 psig min ^-1。最后，为了改善蚀刻过程中的安全操作，使用热动力学分析来确定适当的动力学参数，以进行铜蚀刻剂的热分解。