Rapid digital technology advancement has resulted in a tremendous increase in computing tasks imposing stringent energy efficiency and area efficiency requirements on next-generation computing. To meet the growing data-driven demand, in-memory computing and transistor-based computing have emerged as potent technologies for the implementation of matrix and logic computing. However, to fulfil the future computing requirements new materials are urgently needed to complement the existing Si complementary metal–oxide–semiconductor technology and new technologies must be developed to enable further diversification of electronics and their applications. The abundance and rich variety of electronic properties of two-dimensional materials have endowed them with the potential to enhance computing energy efficiency while enabling continued device downscaling to a feature size below 5 nm. In this Review, from the perspective of matrix and logic computing, we discuss the opportunities, progress and challenges of integrating two-dimensional materials with in-memory computing and transistor-based computing technologies.

数字技术的飞速发展导致计算任务的大量增加，对下一代计算提出了严格的能源效率和面积效率要求。为了满足不断增长的数据驱动需求，内存计算和基于晶体管的计算已经成为实现矩阵和逻辑计算的有效技术。然而，为了满足未来的计算要求，迫切需要新材料来补充现有的硅互补金属氧化物半导体技术，并且必须开发新技术以实现电子产品及其应用的进一步多样化。二维材料的丰富和丰富的电子特性赋予了它们增强计算能效的潜力，同时能够将器件尺寸继续缩小至5 nm以下。在这篇综述中，从矩阵和逻辑计算的角度，我们讨论了将二维材料与内存计算和基于晶体管的计算技术集成在一起的机遇，进展和挑战。