Addition-curing is the most common method for preparing high-performance silicone materials for light-emitting diode (LED) encapsulation. The structure and the hydrogen content of the hydrogen-containing cross-linking agents used in addition reactions have a significant influence on the performance of the cured products. In this study, a series of hydrogen-containing methyl phenyl silicone resins with different hydrogen content were synthesized through hydrolysis condensation. Subsequently, the high-refractive-index hydrogen-containing silicone resins reacted with vinyl methyl phenyl silicone resins to obtain methyl phenyl silicone materials. The cured products showed high light transmittance (> 89% at 450 nm), appropriate hardness and good thermal stability. The tests of reflow soldering (265°C ± 5°C for 10 cycles) and lumen depreciation (50 mA for 165 h) further demonstrated that the prepared silicone materials possessed high thermal resistance and stability. In addition, increasing the hydrogen content enhanced the cross-link density, thereby improving the thermal stability of the silicone materials. The prepared hydrogen-containing methyl phenyl silicone resins can thus serve as a cross-linker for addition-curing in high-power LED encapsulation.

加成固化是制备用于发光二极管（LED）封装的高性能有机硅材料的最常用方法。加成反应中所用的含氢交联剂的结构和氢含量对固化产物的性能有重大影响。本研究通过水解缩合合成了一系列氢含量不同的含氢甲基苯基有机硅树脂。随后，使高折射率的含氢有机硅树脂与乙烯基甲基苯基有机硅树脂反应以获得甲基苯基有机硅材料。固化产物显示出高透光率（在450 nm时> 89％），适当的硬度和良好的热稳定性。回流焊接（265°C±5°C，持续10个循环）和流明衰减（50 mA，持续165 h）的测试进一步证明，所制备的有机硅材料具有较高的耐热性和稳定性。另外，增加氢含量提高了交联密度，从而改善了有机硅材料的热稳定性。所制备的含氢的甲基苯基有机硅树脂因此可以用作高功率LED封装中的加成固化的交联剂。