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Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints
Rare Metals ( IF 8.8 ) Pub Date : 2020-06-24 , DOI: 10.1007/s12598-020-01487-1
Wei-An Wang , Xiao-Ya Li , Yun-Fei Xing , Ming Gu , Long-Hui Fang , Ye-Feng Bao , Jin-Hui Fan

Abstract Sn/Ni–Sn/Sn sandwich joining piece was developed and applied to fabricate segmented half-Heusler/skutterudite thermoelectric joints, and high-temperature service behavior of the joints was studied. The microstructure and contact resistance of the joint before and after aging were investigated. The joints are well bonded and no cracks appear at the interfaces of the joint before and after aging, which can be attributed to the formation of high-melting point intermetallic compounds. The electrical resistance crosses the joining layer smoothly and the contact resistance is low. These results show that the sandwich joining piece is effective and flexible, and promising for the preparation of segmented thermoelectric devices. Graphic abstract

中文翻译:

开发用于制造分段式半赫斯勒/方钴矿热电接头的夹层连接件

摘要 研制了Sn/Ni-Sn/Sn 夹层连接件并应用于制造分段式半赫斯勒/方钴矿热电接头,并研究了接头的高温使用行为。研究了时效前后接头的显微组织和接触电阻。接头结合良好,时效前后接头界面均未出现裂纹,这与高熔点金属间化合物的形成有关。电阻平滑地穿过连接层,接触电阻低。这些结果表明,夹层连接件是有效且灵活的,有望用于制备分段式热电器件。图形摘要
更新日期:2020-06-24
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