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Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints

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Abstract

Sn/Ni–Sn/Sn sandwich joining piece was developed and applied to fabricate segmented half-Heusler/skutterudite thermoelectric joints, and high-temperature service behavior of the joints was studied. The microstructure and contact resistance of the joint before and after aging were investigated. The joints are well bonded and no cracks appear at the interfaces of the joint before and after aging, which can be attributed to the formation of high-melting point intermetallic compounds. The electrical resistance crosses the joining layer smoothly and the contact resistance is low. These results show that the sandwich joining piece is effective and flexible, and promising for the preparation of segmented thermoelectric devices.

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Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (Nos. U1738114, 51372261 and 51879089).

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Hohai University, Changzhou, 213022, China

    Wei-An Wang & Ye-Feng Bao

  2. The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, 200050, China

    Wei-An Wang, Xiao-Ya Li, Yun-Fei Xing, Ming Gu & Long-Hui Fang

  3. School of Mechanical Engineering, Donghua University, Shanghai, 201620, China

    Long-Hui Fang & Jin-Hui Fan

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  1. Wei-An Wang
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Correspondence to Xiao-Ya Li.

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Wang, WA., Li, XY., Xing, YF. et al. Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints. Rare Met. 40, 1966–1970 (2021). https://doi.org/10.1007/s12598-020-01487-1

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  • DOI: https://doi.org/10.1007/s12598-020-01487-1

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