A unique boiling heat transfer study of wetting fluids in a vertical three-dimensional rectangle microchannel was carried out in this paper, to develop a novel passive three-dimensional chip stack cooling technology. The base liquids were deionized water and R113, and Sodium dodecagon sulfate (SDS) was used as a surfactant, which is added into the base fluids for developing wetting fluids. The length, gap, and width of rectangle channels were in the range of 30 mm to 100 mm,30 mm to 50 mm, and 0.4 mm to 4 mm, respectively. Metal wires with different numbers were laid in the rectangle channel along the flow direction for forming change in the width of the microchannel. The study results show that using wetting fluids can significantly enhance both heat transfer coefficients and maximum heat flux of thermosyphon boiling in three-dimensional microchannels compared with that found in pure liquids. The enhanced effects have significant relations with the three-dimensional geometric dimensions. The present experimental results provide significant technology support for passive three-dimensional chip cooling.

本文对垂直三维矩形微通道中的润湿流体进行了独特的沸腾传热研究，以开发一种新颖的被动三维芯片堆叠冷却技术。基础液是去离子水和R113，十二烷基硫酸钠（SDS）用作表面活性剂，将其添加到基础液中以形成润湿液。矩形通道的长度，间隙和宽度分别在30mm至100mm，30mm至50mm和0.4mm至4mm的范围内。将不同数量的金属线沿流动方向放置在矩形通道中，以形成微通道宽度的变化。研究结果表明，与纯液体相比，使用润湿液可以显着提高三维微通道中热虹吸管沸腾的传热系数和最大热通量。增强效果与三维几何尺寸具有显着关系。本实验结果为被动三维芯片冷却提供了重要的技术支持。