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Experimental study on boiling performance of wetting fluids in three-dimensional rectangle microchannels

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Abstract

A unique boiling heat transfer study of wetting fluids in a vertical three-dimensional rectangle microchannel was carried out in this paper, to develop a novel passive three-dimensional chip stack cooling technology. The base liquids were deionized water and R113, and Sodium dodecagon sulfate (SDS) was used as a surfactant, which is added into the base fluids for developing wetting fluids. The length, gap, and width of rectangle channels were in the range of 30 mm to 100 mm,30 mm to 50 mm, and 0.4 mm to 4 mm, respectively. Metal wires with different numbers were laid in the rectangle channel along the flow direction for forming change in the width of the microchannel. The study results show that using wetting fluids can significantly enhance both heat transfer coefficients and maximum heat flux of thermosyphon boiling in three-dimensional microchannels compared with that found in pure liquids. The enhanced effects have significant relations with the three-dimensional geometric dimensions. The present experimental results provide significant technology support for passive three-dimensional chip cooling.

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Abbreviations

D :

hydrodynamic equivalent diameter (m)

g :

gravity (m/s2)

h :

heat transfer coefficient (W/(m2 · K))

h ag :

latent heat of evaporation (J/kg)

L :

height of 3D channel (m)

I :

electric current (A)

P :

power (W)

q :

heat flux (W/m2)

q” :

critical heat flux (W/m2)

S :

surface area (m2)

T :

temperature (°C)

\( \mathit{\Delta }\overline{T} \) :

mean super-heating (K)

U :

voltage (V)

W :

width of the 3D channel (m)

Φ :

dimensionless heat flux

β :

contact angle (°)

ρ :

density (kg/m3)

μ :

dynamic viscosity (Pa · s)

σ :

surface tension coefficient (N/m)

ω :

mass fraction

0 :

pure liquid

s :

wetting liquid, or saturated temperature

w :

heating surface

loss :

heat loss

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Acknowledgments

This work was supported by the national natural science foundation of China under grant No. 51876121.

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Authors and Affiliations

  1. School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China

    Ping-Yang Wang, Xing-Lin Zhao & Zhen-Hua Liu

Authors
  1. Ping-Yang Wang
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  2. Xing-Lin Zhao
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  3. Zhen-Hua Liu
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Corresponding author

Correspondence to Ping-Yang Wang.

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Highlights

• A new wetting fluids as the medium was used in Thermosyphon boiling of 3 D microchannels.

• The new medium significantly improve CHF and HTC in 3-D microchannels.

• The influence of dimensions of 3-D microchannel on the CHF and HTC are very complex.

• Experimental results provide significant technology support for passive 3-D chip cooling.

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Wang, PY., Zhao, XL. & Liu, ZH. Experimental study on boiling performance of wetting fluids in three-dimensional rectangle microchannels. Heat Mass Transfer 56, 2639–2652 (2020). https://doi.org/10.1007/s00231-020-02883-0

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