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A single-ended low leakage and low voltage 10T SRAM cell with high yield
Analog Integrated Circuits and Signal Processing ( IF 1.2 ) Pub Date : 2020-06-08 , DOI: 10.1007/s10470-020-01669-y
Nima Eslami , Behzad Ebrahimi , Erfan Shakouri , Deniz Najafi

This paper presents a low leakage power 10T single-ended SRAM cell in the sub-threshold region that improves read, write, and hold stability. While at low voltages, the write-ability is increased by temporarily floating the data node, the read stability of the cell is maintained approximately as equal as the hold state by separating the data-storage node from the read bit line by using only a single transistor. According to Simulations using HSPICE software in 10 nm FinFET technology, the read stability of the proposed cell is approximately 4.8× higher than the conventional 6T at 200 mV. Furthermore, the proposed cell is found to have the lowest static power dissipation, as it tends to be 4% lower than the standard six-transistor cell at this voltage. This study shows that the yield of the proposed cell is higher than 6σ in all operations, and supply voltages down to 200 mV.



中文翻译:

高成品率的单端低泄漏低电压10T SRAM单元

本文在亚阈值区域展示了一种低泄漏功率的10T单端SRAM单元,该单元提高了读取,写入和保持的稳定性。在低电压下,通过暂时使数据节点浮置来提高可写性,而通过仅使用单个存储单元将数据存储节点与读取位线分开,则可以将单元的读取稳定性保持为近似等于保持状态晶体管。根据在10 nm FinFET技术中使用HSPICE软件进行的仿真,在200 mV电压下,所建议单元的读取稳定性比传统6T高约4.8倍。此外,发现拟议的电池具有最低的静态功耗,因为在此电压下它往往比标准的六晶体管电池低4%。这项研究表明,所提出的细胞产率高于 在所有操作中,电源电压低至200 mV。

更新日期:2020-06-08
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