The purpose of this study was to determine the depth of cure and the type and amount of monomers released from bulk-fill composites in different curing protocols. Five different composite resins Filtek Bulk-Fill Posterior, Filtek Bulk-Fill Flowable, SureFil SDR, X-tra Fil, and X-tra base, were used. A light-emitting diode (LED) device was used in 3 different modes (standard, high power, and extra power mode), and a halogen light device was also used as a control. Surface hardness was measured and the depth of cure was calculated. Monomer analysis was performed using high performance liquid chromatography (HPLC). The data were analyzed using Tamhane’s T2 post-hoc test (α = 0.05). The cure depth for all materials except for Filtek Bulk-Fill Posterior (extra power mode) and Filtek Bulk-Fill Flowable (high power and extra power modes) was over 80%. Under the conditions of this study, the amount of monomer released from composite resins changed according to the type of composite resin and the light mode used.

这项研究的目的是确定固化深度以及在不同固化方案下从填充复合材料中释放的单体的类型和数量。使用了五种不同的复合树脂Filtek Bulk-Fill后装，Filtek Bulk-Fill Flowable，SureFil SDR，X-tra Fil和X-tra基础。发光二极管（LED）装置用于3种不同的模式（标准，高功率和超功率模式），卤素灯装置也用作控件。测量表面硬度并计算固化深度。单体分析使用高效液相色谱法（HPLC）进行。使用Tamhane T2事后检验分析数据（α= 0.05）。除Filtek大量填充后部（额外功率模式）和Filtek大量填充可流动性（高功率和额外功率模式）以外，所有材料的固化深度均超过80％。