Mechanical strength and thermal properties may limit the usage of an electronic component in the high-tech industry. This paper investigated the influence of using CuO nanoparticles in a radial configuration microchannel of a disk from the mechanical and thermal points of view. In this regard, a disk under thermal and mechanical loading had been considered. The cooling setup consisted of a radial configuration microchannel with a constant fluid volume. Water was used as the base fluid and CuO particles were used as the coolant fluid. The results showed that the use of CuO nanoparticles would reduce the maximum disk temperature, the maximum thermal stress, and the maximum stress, as well as the maximum deformation on the body. The increasing number of channels would increase the maximum stress in the object as well. Another remarkable point was that increasing the nanoparticles did not necessarily lead to a more uniform heat distribution in the disk.

中文翻译：

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使用纳米流体的圆盘形电子元件的冷却增强和应力降低优化

机械强度和热性能可能会限制电子元件在高科技行业中的使用。本文从机械和热的角度研究了在圆盘的径向配置微通道中使用 CuO 纳米颗粒的影响。在这方面，已经考虑了在热和机械负载下的磁盘。冷却装置由具有恒定流体体积的径向配置微通道组成。水用作基液，CuO颗粒用作冷却液。结果表明，CuO纳米颗粒的使用会降低最大盘温度、最大热应力和最大应力，以及对身体的最大变形。通道数量的增加也会增加物体中的最大应力。