The demand for crystalline silicon wafers is continuing to increase. It is inevitable that high-purity silicon will be lost as loose abrasive slurry silicon powder (LASSP) and diamond wire saw silicon powder (DWSSP) during the process of wafer preparation. For this reason, some advanced processes or methods require further development to solve the problems of the high production cost, silicon wafer shortage, and environmental pollution caused by these silicon resources. Some processes and technologies for silicon recovery and purification from LASSP and DWSSP are comprehensively reviewed in this paper. These investigations inform some anticipated technological trends and required improvements, and encourage the development of technological solutions. Furthermore, the authors propose that high-purity silicon for industrial implementations can be recycled from LASSP and DWSSP via a combined process of an acid leaching pretreatment and a high-temperature treatment. Additionally, some existing deficiencies and areas that require enhancement are also proposed for improved impurity removal and silicon recovery with a higher process efficiency.

中文翻译：

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锯切硅粉中硅的回收与提纯研究进展

对晶体硅片的需求持续增长。在晶圆制备过程中，高纯硅不可避免地会以松散的磨料浆硅粉（LASSP）和金刚石线锯硅粉（DWSSP）的形式流失。为此，一些先进的工艺或方法需要进一步发展，以解决这些硅资源造成的生产成本高、硅片短缺、环境污染等问题。本文综合综述了从 LASSP 和 DWSSP 中回收和提纯硅的一些工艺和技术。这些调查为一些预期的技术趋势和需要的改进提供了信息，并鼓励了技术解决方案的开发。此外，作者提出，可以通过酸浸预处理和高温处理的组合工艺，从 LASSP 和 DWSSP 中回收用于工业实施的高纯度硅。此外，还提出了一些现有的缺陷和需要改进的领域，以提高杂质去除率和硅回收率，并具有更高的工艺效率。