Abstract

An electro-mechanical degradation model is developed to evaluate the electronic and mechanical reliability performance of metal films due to fatigue accumulation. The model establishes the relationship between electrical resistivity and damage, which can be used to predict the change in electrical resistivity and damage evolution of metal films under fatigue loading. Based on the developed model, fatigue damage evolution and change in electrical resistivity simulation of metal films can be implemented to evaluate the electronic and mechanical reliability performance of metal films for the condition where the stress/strain level is heterogeneous. As a case study, fatigue damage evolution and change in electrical resistivity of a copper film on flexible substrate under cyclic loading is numerical analyzed and compared with experiment. It shows that the electro-mechanical degradation model and implemented simulation are effective, and can be used to evaluate the electronic and mechanical reliability performance of metal films due to fatigue accumulation reasonably.

Graphic Abstract

摘要

建立了机电退化模型，以评估由于疲劳累积而产生的金属膜的电子和机械可靠性性能。该模型建立了电阻率和损伤之间的关系，可用于预测疲劳载荷下金属膜的电阻率变化和损伤演变。基于开发的模型，可以实现疲劳损伤的演变和金属膜电阻率模拟的变化，以评估应力/应变水平不均匀的条件下金属膜的电子和机械可靠性性能。作为实例研究，对循环载荷下柔性基板上铜膜的疲劳损伤演化和电阻率变化进行了数值分析，并与实验进行了比较。

图形摘要