Abstract

In this paper, microstructures, interface reaction, and stress–strain response of Sn–3.8Ag–0.7Cu and Sn–3.8Ag–0.7Cu–0.5CuZnAl solders on Fe substrate were investigated systematically. The interface reaction and the growth behavior of FeSn₂ intermetallic compounds (IMC) at two solder joints interface after 250 °C soldering with 1 min, 10 min, and 60 min are shown. The results indicate that the growth rate of FeSn₂ IMC of Sn–3.8Ag–0.7Cu/Fe solder joints was higher than that of Sn–3.8Ag–0.7Cu–0.5CuZnAl/Fe solder joints, the addition of 0.5% CuZnAl particles can decrease the growth rate of interfacial FeSn₂ IMC layer with the reduction of elements diffusion coefficient. Based on finite element simulation, it is demonstrated that the addition of CuZnAl particles can decrease the von Mises stress and equivalent creep strain of Sn–3.8Ag–0.7Cu/Fe solder joints, due to the decrease of FeSn₂ thickness with the addition of CuZnAl particles, which can enhance the reliability of Sn–3.8Ag–0.7Cu/Fe solder joints.

中文翻译：

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Fe基体上Sn-Ag-Cu和Sn-Ag-Cu-0.5CuZnAl焊料的微观结构，界面反应和性能

摘要

在本文中，系统地研究了在Fe基体上的Sn–3.8Ag–0.7Cu和Sn–3.8Ag–0.7Cu–0.5CuZnAl焊料的微观结构，界面反应和应力应变响应。显示了在250°C焊接1分钟，10分钟和60分钟后，两个焊点界面处的FeSn ₂金属间化合物（IMC）的界面反应和生长行为。结果表明，添加0.5％CuZnAl颗粒后，Sn–3.8Ag–0.7Cu / Fe焊点的FeSn ₂ IMC的生长速率高于Sn–3.8Ag–0.7Cu–0.5CuZnAl / Fe焊点的FeSn ₂ IMC的生长速率可以降低界面FeSn ₂的生长速率随着IMC层元素扩散系数的减小。基于有限元模拟，表明添加CuZnAl颗粒可以降低SnS–3.8Ag–0.7Cu / Fe焊点的von Mises应力和等效蠕变应变，这是由于添加FeSn _2会降低FeSn ₂厚度CuZnAl颗粒，可以增强Sn–3.8Ag–0.7Cu / Fe焊点的可靠性。