Cu–carbon nanotube (CNT) hybrids combine the advantages of the high electrical conductivity of Cu with the low temperature coefficient of resistance for CNTs, but require enhanced interfacing to improve the electrical performance when exposed to elevated temperatures. Herein, Ti and Ni were investigated as adhesion metals by thermally evaporating 10 nm layers onto a CNT conductor. SEM analysis shows Ni deposits as discrete nanoscale crystallites which coalesce after annealing to 400 °C in H 2 /Ar. Ti deposits uniformly along the CNT surface and is stable over such temperatures. A 100 nm deposition of Cu is shown to delaminate from the CNTs after annealing, and the resistance per length ( R / L ) increases by 40%. The Cu–Ni–CNT exhibits a 125% increase, while the Cu–Ti–CNT achieves a 12% decrease in R / L , for similar annealing conditions. Thus, Ti emerges as an effective adhesion metal, warranting its use in metal–CNT wire technologies for elevated temperature operation.

中文翻译：

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具有钛粘附层的增强型铜-碳纳米管混合导体

Cu-碳纳米管 (CNT) 杂化材料结合了 Cu 的高导电性和 CNT 的低电阻温度系数的优点，但需要增强接口以提高暴露于高温时的电气性能。在本文中，通过将 10 nm 层热蒸发到 CNT 导体上，研究了作为粘附金属的 Ti 和 Ni。SEM 分析显示，Ni 沉积物为离散的纳米级微晶，在 H 2 /Ar 中退火至 400 °C 后会聚结。Ti沿CNT表面均匀沉积并且在这样的温度下是稳定的。显示 100 nm 的 Cu 沉积在退火后与 CNT 分层，并且单位长度的电阻 (R / L) 增加了 40%。对于类似的退火条件，Cu-Ni-CNT 表现出 125% 的增加，而 Cu-Ti-CNT 的 R / L 降低了 12%。因此，