Computing platforms ranging from embedded systems to server blades comprise of multiple Systems-on-Chips (SoCs). Conventionally, communication between chips in these multichip platforms are realized using high-speed I/O modules over metal traces on a substrate. Due to the high-power consumption of I/O modules and non-scalable pitch of pins or solder bumps their bandwidth density and power consumption becomes bottleneck for multichip systems. Wireless chip-to-chip communication is emerging as an alternative solution to the traditional interconnection challenges of multichip systems. Novel devices based on graphene structures capable of establishing wireless links are explored in recent literature to provide high bandwidth THz links. In this work, we propose to utilize graphene-based wireless links to enable energy-efficient, multi-modal chip-to-chip communication protocol to create toroidal folding based interconnection architectures for multichip systems. With cycle-accurate simulations we demonstrate that such designs can outperform state-of-the-art wireline multichip systems.

从嵌入式系统到刀片服务器的计算平台包括多个片上系统（SoC）。传统上，这些多芯片平台中的芯片之间的通信是通过在衬底上的金属迹线上使用高速I / O模块来实现的。由于I / O模块的高功耗以及引脚或焊料凸块的间距无法缩放，因此其带宽密度和功耗成为多芯片系统的瓶颈。无线芯片到芯片通信正在作为对多芯片系统的传统互连挑战的替代解决方案而出现。在最近的文献中探索了基于能够建立无线链路的石墨烯结构的新型设备，以提供高带宽的太赫兹链路。在这项工作中，我们建议利用基于石墨烯的无线链路来实现节能，多模态芯片到芯片通信协议，以为多芯片系统创建基于环形折叠的互连架构。通过精确的周期仿真，我们证明了这种设计可以胜过最新的有线多芯片系统。