Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD),Advanced Functional Materials

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Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)
Advanced Functional Materials ( IF 18.5 ) Pub Date : 2018-12-13 , DOI: 10.1002/adfm.201806440
Joonsoo Jeong _{1,

2} , Farah Laiwalla ₁ , Jihun Lee ₁ , Riina Ritasalo ₃ , Marko Pudas ₃ , Lawrence Larson ₁ , Vincent Leung ₄ , Arto Nurmikko ₁

Affiliation

A hermetic sealing method of sub‐millimeter‐sized microelectronic chiplets for wireless body implants is presented by ultrathin and electromagnetically transparent atomic layer deposition (ALD) coatings. Fully 3D conformal encapsulation of wirelessly powered microdevices is demonstrated both with and without opening windows for electrophysiological measurements. The chiplets embedding custom application‐specific integrated circuits (ASICs) with radio frequency (RF) transmitters are encapsulated by a stack of alternating layers of hafnium oxide and silicon dioxide to maximize impermeability of water and ionic penetration while minimizing the volume of the packaging material. The hermeticity of the devices is characterized through accelerated aging tests in saline at T = 87 °C, while continued functionality is monitored via evaluation of backscattered RF signals (near 1 GHz) to ascertain possible degradation and electronic failure. Earliest failures of wirelessly functional devices occur after more than 180 d of immersion at 87 °C. Wireless devices having opening windows through the ALD envelope show no signs of degradation for >100 d. This implies an equivalent lifetime >10 years at T = 37 °C. This approach is readily scalable to high throughput batch processing of hundreds of microchiplets, offering a methodology for hermetic packaging of microscale biomedical chronic implants.

中文翻译：

通过多层原子层沉积（ALD）对无线微电子可植入小芯片进行共形气密密封

超薄和电磁透明原子层沉积（ALD）涂层提出了一种用于无线人体植入物的亚毫米大小的微电子小芯片的气密密封方法。在打开和不打开用于电生理学测量的窗口的情况下，都演示了无线微型设备的完全3D保形封装。嵌入定制专用集成电路（ASIC）和射频（RF）发射机的小芯片由氧化ha和二氧化硅的交替层堆叠封装，以最大程度地提高水和离子渗透的不渗透性，同时使包装材料的体积最小化。通过在T温度下的盐水中加速老化测试来表征设备的气密性= 87°C，同时通过评估反向散射的RF信号（接近1 GHz）来监视连续功能，以确定可能的降级和电子故障。无线功能设备最早的故障发生在87°C的温度下浸泡180 d以上。具有通过ALD包络的打开窗口的无线设备在> 100 d内未显示出降级的迹象。这意味着在T = 37°C时的等效寿命> 10年。这种方法很容易扩展到数百个微芯片的高通量批处理，从而为微型生物医学慢性植入物的气密包装提供了一种方法。

更新日期：2018-12-13

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