Abstract Removing particles from the device is a challenging in the micro-field. The traditional method is easy to often result in device damage. Therefore, developing an alternative method to resolve the shortcomings is necessary for micro-contamination removal. In this study, a non-contact method is presented, which is based on the shock wave for removal of particles from substrate surface. A series of experiments of particle removal and simulation mode of shock wave characteristics was performed to investigate the removal mechanisms, particle removal modes, and the influence of relevant parameters (laser energy, particle properties, and gap distance d) on particle removal. By analyzing the experimental and simulation results, the particle removal mechanism is dominated by the shock wave ejection mechanism, which is owned to its strong pressure. The particle removal velocity is closely related to the gap distance d and the laser energy, and the maximum velocity was approximately 0.0138Mach for gap distance d is ∼ 1.45 mm at the energy of 9.32 mJ. Moreover, it is considered that the detachment will be obtained by the combination of lifting, rolling and sliding modes. Our basic research contributes to a better understanding of the particle removal.

中文翻译：

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通过基于激光诱导等离子体冲击波的单个粒子的运动来探索粒子去除

摘要 从器件中去除颗粒是微领域的一项挑战。传统的方法容易经常造成器件损坏。因此，开发一种替代方法来解决微污染去除的缺点是必要的。在这项研究中，提出了一种非接触式方法，该方法基于冲击波从基板表面去除颗粒。进行了一系列颗粒去除实验和冲击波特性模拟模式，研究了去除机理、颗粒去除模式以及相关参数（激光能量、颗粒特性和间隙距离d）对颗粒去除的影响。通过对实验和模拟结果的分析，颗粒去除机制以冲击波喷射机制为主，其具有强大的压力。粒子去除速度与间隙距离 d 和激光能量密切相关，当能量为 9.32 mJ 时，间隙距离 d 约为 1.45 mm 时，最大速度约为 0.0138 马赫。此外，还认为通过提升、滚动和滑动模式的组合来获得脱离。我们的基础研究有助于更好地了解颗粒去除。