Abstract This paper describes numerically and experimentally how the phased array antenna which is subjected to a discrete heat load can be kept under the uniform temperature by the topology design of microchannels. First, a model of microchannel with two discrete heat sources is established and the result presents that temperature gradient between chips in series connection cannot be eliminated in the typical straight channels. Then the multi-scale leaf vein-shaped microchannel network including the first order assembly (FOA), second order(SOA), and the third order (TOA) are proposed, and the result shows that TOA yields the lowest chip temperature and the best temperate uniformity evaluated by the standard deviation of temperature (SDT). The number of microchannels in SOA and TOA are subsequently optimized with the criterion of minimum SDT. Finally, the optimal SOA and TOA are made by 3D printing technique and the orthogonal test is carried out to investigate the effect of inlet fluid temperature, volumetric flow rate and heat flux. The experiment result testifies that TOA has better temperature uniformity than SOA with the decrease of inlet fluid temperature and the increases of volumetric flow rate, and the difference between them increases with the increasing heat flux. Therefore, TOA is recommend for the improvement of temperature uniformity with the ever-increasing heat flux.

中文翻译：

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用于相控阵天线冷却的对流叶脉状流体微通道的温度均匀性

摘要 本文通过数值和实验描述了如何通过微通道拓扑设计使承受离散热载荷的相控阵天线保持在均匀温度下。首先，建立了具有两个离散热源的微通道模型，结果表明，在典型的直通道中，串联芯片之间的温度梯度无法消除。然后提出了包括一阶组装（FOA）、二阶（SOA）和三阶（TOA）的多尺度叶脉形微通道网络，结果表明TOA产生的芯片温度最低，最好由温度标准偏差 (SDT) 评估的温带均匀性。SOA 和 TOA 中的微通道数量随后以最小 SDT 为准则进行优化。最后，通过3D打印技术制作出最优SOA和TOA，并进行正交试验，研究入口流体温度、体积流量和热通量的影响。实验结果表明，随着入口流体温度的降低和体积流量的增加，TOA比SOA具有更好的温度均匀性，并且它们之间的差异随着热通量的增加而增加。因此，在热通量不断增加的情况下，建议使用 TOA 来改善温度均匀性。实验结果表明，随着入口流体温度的降低和体积流量的增加，TOA比SOA具有更好的温度均匀性，并且它们之间的差异随着热通量的增加而增加。因此，在热通量不断增加的情况下，建议使用 TOA 来改善温度均匀性。实验结果表明，随着入口流体温度的降低和体积流量的增加，TOA比SOA具有更好的温度均匀性，并且它们之间的差异随着热通量的增加而增加。因此，在热通量不断增加的情况下，建议使用 TOA 来改善温度均匀性。