The bandgap of organics is an important descriptor to evaluate the interface adhesion of an organic agent on metal surface. However, insight into the role of chalcogens tuning of π-conjugated materials in influencing the bandgap is still deficient. Here, a family of diketopyrrolopyrrole(DPP)-based quaternary ammonium salts containing different chalcogens are innovatively synthesized through bottom-up strategy and served as new levelers in conformal copper electrodeposition. The photophysical and electrochemical properties including cyclic voltammetry (CV),potentiodynamic polarization curves and galvanostatic measurements (GMs) of those compounds were tested. Compared with other counterparts, SeDPP-QAS presents the narrowest bandgap showing great potential in conformal copper electrodeposition. Through-hole electroplating test and the scanning electron microscope (SEM) images of coating layer demonstrate that bandgap tuning is an efficient method to level and regulate the electrodeposition performance. Besides, theoretical calculations and X-ray photoelectron spectroscopy (XPS) were applied detect the adsorption mechanism between organic agent and copper surface. This work broadens the understanding of bandgap engineering of organics in copper electrodeposition, and provides guidance for the future design of organic materials in adsorbing other metal-based materials.

有机物的带隙是评估有机剂在金属表面上的界面粘附力的重要指标。但是，对硫族元素调节π共轭材料在影响带隙方面的作用的认识仍然不足。在这里，通过自下而上的策略创新地合成了包含不同硫族元素的基于二酮吡咯并吡咯（DPP）的季铵盐家族，并在保形铜电沉积中用作新的整平剂。测试了这些化合物的光物理和电化学性质，包括循环伏安法（CV），电势极化曲线和恒电流测量值（GMs）。与其他同类产品相比，SeDPP-QAS具有最窄的带隙，在保形铜电沉积中显示出巨大的潜力。通孔电镀测试和涂层的扫描电子显微镜（SEM）图像表明，带隙调谐是一种有效的方法来调节和调节电沉积性能。此外，通过理论计算和X射线光电子能谱（XPS）检测有机物与铜表面之间的吸附机理。这项工作拓宽了对铜电沉积中有机物的带隙工程学的理解，并为有机材料在吸附其他金属基材料方面的未来设计提供了指导。通过理论计算和X射线光电子能谱（XPS）检测有机剂与铜表面的吸附机理。这项工作拓宽了对铜电沉积中有机物的带隙工程学的理解，并为有机材料在吸附其他金属基材料方面的未来设计提供了指导。通过理论计算和X射线光电子能谱（XPS）检测有机剂与铜表面的吸附机理。这项工作拓宽了对铜电沉积中有机物的带隙工程学的理解，并为有机材料在吸附其他金属基材料方面的未来设计提供了指导。