Physical, mechanical, thermal, and dielectric behavior of surface modified hexagonal boron nitride (hBN) in epoxy matrix was investigated in this paper. Effective treatment of microsize boron nitride involved silane coupling agent, (γ‐aminopropyl)triethoxysilane such that the coating resulted from the treatment amounted to 2% of the weight of silane coupling agent of the treated BN. The present work revealed that the chemical treatment of BN surface could effectively enhance the adhesion between matrix and filler material. The dispersion and wettability of the BN powder in epoxy matrix after surface treatment were improved. These imparted improved physical and excellent mechanical and thermal properties to the developed material. The experimental study on thermal properties of fabricated composites indicated that incorporation of modified particles exhibits improved glass transition temperature. As filler loading increases, coefficient of thermal expansion of composite decreases which further decreases when treated filler were used. Further, appreciable improvement in thermal conductivity is obtained when treated hBN is used in place of untreated one. The dielectric properties are investigated for wide frequency range and filler content and found to be increased with hBN content and decrease with frequency enhancement. Furthermore, mechanical properties of such composites were also largely enhanced when treated fillers were used. With modified properties, the presently developed material is suitable for microelectronic applications.

中文翻译：

---

颗粒表面处理对环氧/六方氮化硼复合材料的物理，机械，热和介电性能的影响

本文研究了环氧基体中表面改性的六方氮化硼（hBN）的物理，机械，热和介电行为。微米级氮化硼的有效处理涉及硅烷偶联剂（γ-氨基丙基）三乙氧基硅烷，使得该处理产生的涂层占已处理BN硅烷偶联剂重量的2％。目前的工作表明，对BN表面进行化学处理可以有效地增强基体与填充材料之间的附着力。表面处理后，BN粉末在环氧树脂基体中的分散性和润湿性得到改善。这些赋予所开发的材料改进的物理性能以及优异的机械和热性能。对复合材料热性能的实验研究表明，改性颗粒的掺入具有改善的玻璃化转变温度。随着填料含量的增加，复合材料的热膨胀系数降低，当使用处理过的填料时，热膨胀系数进一步降低。此外，当使用处理过的hBN代替未处理过的hBN时，可以显着提高导热系数。对宽频率范围和填料含量的介电性能进行了研究，发现它们随hBN含量的增加而增加，随频率的提高而下降。此外，当使用处理过的填料时，这种复合材料的机械性能也大大提高。具有改进的性能，当前开发的材料适用于微电子应用。