Tungsten-Copper (WCu) composites are promising materials for electrical and thermal applications. However, their fabrication remains limited using conventional techniques, such as powder metallurgy, which are not suitable for manufacturing densified complex WCu components. In this work, laser additive manufacturing (LAM) technology was introduced for fabricating W-25 wt%Cu composites. A densified WCu composite, free of apparent cracks and pores, is successfully synthesized using optimum process parameters of laser power 2000 W and laser scan speed 360 mm/min in an Ar atmosphere with less than 10 ppm O. The densification of WCu composites is owing to the sufficient wetting of solid W particles by the molten liquid Cu and the surface smoothing of the W particles. The good wetting of the solid W particles by the liquid Cu is due to the low oxygen content and the combined effect of increased capillary force and reduced friction force. The W grains are rounded, indicating some solution-reprecipitation of sharp particle edges originating from the increase in solubility from curvature effects.

钨铜（W Cu）复合材料是用于电气和热学应用的有前途的材料。但是，它们的制造仍然受常规技术（例如粉末冶金）的限制，这些技术不适用于制造致密的复杂W Cu组件。在这项工作中，引入了激光增材制造（LAM）技术来制造W-25 wt％Cu复合材料。使用最佳激光功率2000 W和激光扫描速度360 mm / min在Ar气氛中O含量低于10 ppm的情况下，成功合成了无明显裂纹和细孔的致密W Cu复合材料。W的致密化Cu复合材料是由于熔融的液态Cu对固体W颗粒有足够的润湿作用，并且W颗粒的表面光滑。液态铜对固态W颗粒的良好润湿性是由于低的氧含量以及增加的毛细作用力和减小的摩擦力的综合作用。W晶粒是圆形的，表明由于曲率效应引起的溶解度增加，导致尖锐的颗粒边缘发生了溶液再沉淀。