The crack-healing behaviors and microstructure evolution of pure tungsten produced by laser powder bed fusion (LPBF) were studied and compared before and after post hot isostatic pressing (post-HIP) treatment. An average thermal conductivity of 133 W·m⁻¹·K⁻¹ at room temperature (RT) was obtained after HIP, which was 16% higher than that of as-built sample (115 W·m⁻¹·K⁻¹). Although the HIP process had little effect on density, it resulted in a large grain size of >300 μm accompanied by a decrease in dislocation density and crack healing, which led to a substantial improvement of thermal conductivity of pure tungsten. The positive correlation between relative density and thermal conductivity of as-built tungsten was reported.

研究并比较了热等静压后（HIP后）处理前后激光粉末床熔合（LPBF）产生的纯钨的裂纹愈合行为和微观组织演变。经HIP处理后，在室温（RT）下获得的平均导热系数为133 W·m ^-1 ·K ^-1，比在建样品的平均导热系数（115 W·m ^-1 ·K ^-1）高16％。。尽管HIP工艺对密度几乎没有影响，但它导致了大于300μm的大晶粒尺寸，并伴随着位错密度的降低和裂纹的愈合，从而导致纯钨的导热率大大提高。据报道，钨的相对密度与导热系数之间存在正相关关系。