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The effect of hot isostatic pressing on thermal conductivity of additively manufactured pure tungsten
International Journal of Refractory Metals & Hard Materials ( IF 2.794 ) Pub Date : 2019-11-06 , DOI: 10.1016/j.ijrmhm.2019.105135
Jinhan Chen, Kailun Li, Yafei Wang, Leilei Xing, Chenfan Yu, Hailong Liu, Jing Ma, Wei Liu, Zhijian Shen

The crack-healing behaviors and microstructure evolution of pure tungsten produced by laser powder bed fusion (LPBF) were studied and compared before and after post hot isostatic pressing (post-HIP) treatment. An average thermal conductivity of 133 W·m−1·K−1 at room temperature (RT) was obtained after HIP, which was 16% higher than that of as-built sample (115 W·m−1·K−1). Although the HIP process had little effect on density, it resulted in a large grain size of >300 μm accompanied by a decrease in dislocation density and crack healing, which led to a substantial improvement of thermal conductivity of pure tungsten. The positive correlation between relative density and thermal conductivity of as-built tungsten was reported.
更新日期:2019-12-11

 

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