Abstract Superhydrophobic (SH) Copper salt was prepared with the help of three different chemical etching agents and characterized by various analytical techniques like Fourier transform infrared (FTIR) spectroscopy, UV–visible spectroscopy, X-ray diffractogram (XRD), X-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and scanning electron microscopy (SEM). The SH nature of the material was confirmed by water contact angle (WCA) measurement. Cu surface with the etching agent was made to produce SH Cu surface. Among the chemical etching agents the system with Cl, F and Si exhibited the SH character. The SH hierarchically structured heterogeneous materials produced were used as a catalyst for the reduction of Cr(VI) and 4-nitrophenol (NiP). The catalytic activities of the materials were compared on the apparent rate constant (kapp) and induction time (Ti). Among the catalyst systems used, the Cu-Trichoropentaflourooctylsilane (TCPFOSi) system exhibited the highest kapp and Ti values.

中文翻译：

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铜基超疏水催化剂的表征与应用

摘要 在三种不同化学蚀刻剂的帮助下制备了超疏水 (SH) 铜盐，并通过傅里叶变换红外 (FTIR) 光谱、紫外-可见光谱、X 射线衍射图 (XRD)、X 射线光电子等多种分析技术对其进行表征。光谱 (XPS)、高分辨率透射电子显微镜 (HRTEM) 和扫描电子显微镜 (SEM)。通过水接触角 (WCA) 测量证实了材料的 SH 性质。用蚀刻剂使Cu表面产生SH Cu表面。在化学蚀刻剂中，含Cl、F和Si的体系表现出SH特性。产生的 SH 分层结构的非均质材料用作还原 Cr(VI) 和 4-硝基苯酚 (NiP) 的催化剂。通过表观速率常数 (kapp) 和诱导时间 (Ti) 比较材料的催化活性。在使用的催化剂体系中，Cu-三氯五氟辛基硅烷 (TCPFOSi) 体系表现出最高的 kapp 和 Ti 值。