Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants,Advanced Materials Technologies

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Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants
Advanced Materials Technologies ( IF 6.4 ) Pub Date : 2019-11-29 , DOI: 10.1002/admt.201900800
Jinghua Li _{1,

2,

3} , Rui Li ₄ , Chia‐Han Chiang ₅ , Yishan Zhong ₂ , Haixu Shen ₁ , Enming Song _{2,

6} , Mackenna Hill ₅ , Sang Min Won _{2,

6} , Ki Jun Yu ₇ , Janice Mihyun Baek ₈ , Yujin Lee ₈ , Jonathan Viventi ₅ , Yonggang Huang ₉ , John A. Rogers _{1,

2,

10}

Affiliation

Department of Materials Science and EngineeringNorthwestern University Evanston IL 60208 USA
Department of Materials Science and EngineeringFrederick Seitz Materials Research LaboratoryUniversity of Illinois at Urbana‐Champaign Urbana IL 61801 USA
Department of Materials Science and EngineeringCenter for Chronic Brain InjuryThe Ohio State University Columbus OH 43210 USA
State Key Laboratory of Structural Analysis for Industrial EquipmentDepartment of Engineering MechanicsInternational Research Center for Computational MechanicsDalian University of Technology Dalian 116024 P. R. China
Department of Biomedical EngineeringDuke University Durham NC 27708 USA
Center for Bio‐Integrated ElectronicsNorthwestern University Evanston IL 60208 USA
School of Electrical and Electronic EngineeringYonsei University Seoul 03722 Republic of Korea
Department of ChemistryUniversity of Illinois at Urbana‐Champaign Urbana IL 61801 USA
Department of Civil and Environmental EngineeringMechanical EngineeringMaterials Science and EngineeringCenter of Bio‐Integrated electronicsNorthwestern University Evanston IL 60208 USA
Center for Bio‐Integrated ElectronicsSimpson Querrey Institute for BioNanotechnologyDepartment of Materials Science and EngineeringBiomedical EngineeringChemistryMechanical EngineeringElectrical Engineering and Computer Science, and Neurological SurgeryMcCormick School of Engineering and Feinberg School of Medicine Northwestern University Evanston IL 60208 USA

Bioimplants that incorporate active electronic components at the tissue interface rely critically on materials that are biocompatible, impermeable to biofluids, and capable of intimate electrical coupling for high‐quality, chronically stable operation in vivo. This study reports a materials strategy that combines silicon nanomembranes, thermally grown layers of SiO₂ and ultrathin capping structures in materials with high dielectric constants as the basis for flexible and implantable electronics with high performance capabilities in electrophysiological mapping. Accelerated soak tests at elevated temperatures and results of theoretical modeling indicate that appropriately designed capping layers can effectively limit biofluid penetration and dramatically extend the lifetimes of the underlying electronic materials when immersed in simulated biofluids. Demonstration of these approaches with actively multiplexed, amplified systems that incorporate more than 100 transistors in thin, flexible platforms highlights the key capabilities and the favorable scaling properties. These results offer an effective encapsulation approach for long‐lived bioelectronic systems with broad potential for applications in biomedical research and clinical practice.

中文翻译：

柔性，寿命长的生物植入物中具有导电互连的硅电子用超薄，高电容封盖层

在组织界面结合了活性电子成分的生物植入物严重依赖于生物相容性，生物流体不可渗透的材料，并且能够紧密电耦合以实现高质量，长期稳定的体内操作。这项研究报告了一种结合了硅纳米膜，热生长的SiO ₂层的材料策略具有高介电常数的材料中的超薄覆盖结构，是柔性和可植入电子设备的基础，这些电子设备在电生理标测中具有高性能。高温下的加速浸泡测试和理论建模结果表明，适当设计的覆盖层可以有效地限制生物流体的渗透，并在浸入模拟生物流体中时显着延长基础电子材料的寿命。主动复用，放大的系统在薄而灵活的平台中结合了100多个晶体管，对这些方法进行了演示，突出了关键功能和良好的缩放特性。

更新日期：2020-01-13

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