Abstract To remove subsurface damage and surface irregularities, we demonstrated a high-precision mechanical polishing technique with a polishing plate charged with micron-sized diamond abrasive grains. First, we prepared a polishing plate with a uniform protrusion height of the diamond abrasive grains and evaluated its geometrical structure with a scanning laser microscope. Subsequently, to determine the influence of the protrusion height of the diamond abrasive grains on polishing performance, we performed the mechanical polishing of a single-crystal diamond (100) substrate using two types of polishing plates. The obtained results showed that, using our mechanical polishing technique, the polishing plate with a uniform protrusion height of the grains could be fabricated and a high surface quality of the diamond substrate could be achieved. Moreover, the polishing plate significantly influenced the surface roughness of the polished diamond surfaces. During mechanical polishing, an average roughness (Ra) ranging from ~0.1 nm to 0.3 nm was obtained easily by controlling the process parameters.

中文翻译：

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利用微米级金刚石磨粒对金刚石基体进行高精度机械抛光的方法

摘要 为了去除次表面损伤和表面不规则，我们展示了一种高精度机械抛光技术，其中抛光板装有微米级金刚石磨粒。首先，我们准备了一块金刚石磨粒突出高度均匀的抛光板，并用扫描激光显微镜对其几何结构进行了评估。随后，为了确定金刚石磨粒的突出高度对抛光性能的影响，我们使用两种抛光板对单晶金刚石（100）基板进行了机械抛光。所得结果表明，采用我们的机械抛光技术，可以制造出具有均匀晶粒突出高度的抛光板，并且可以获得高表面质量的金刚石基板。此外，抛光板显着影响抛光金刚石表面的表面粗糙度。在机械抛光过程中，通过控制工艺参数可以轻松获得约 0.1 nm 至 0.3 nm 的平均粗糙度 (Ra)。