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Control of nanoscale material removal in diamond polishing by using iron at low temperature
Journal of Materials Processing Technology ( IF 6.7 ) Pub Date : 2020-04-01 , DOI: 10.1016/j.jmatprotec.2019.116521
Ning Yang , Wen Huang , Dajiang Lei

Abstract Diamond is the most promising material for future applications in the fields of semiconductors and optics due to its extraordinary physical properties. The development of diamond processing technology, especially polishing, is of great importance for diamond applications. Diamond friction during polishing usually occurs at room temperature. In this paper, the material removal rate at low temperature (about the temperature of liquid nitrogen) is studied by using molecular dynamics (MD) simulation and designed experiments. This study reveals that the inhibitory effect of low temperature on diamond removal is an efficient way to control the diamond material removal rate in the nanoscale range and enables the control of material removal on an atomic scale in diamond polishing.

中文翻译:

用铁在低温下控制金刚石抛光中纳米级材料的去除

摘要 金刚石由于其非凡的物理特性,是未来在半导体和光学领域应用的最有前途的材料。金刚石加工技术的发展,特别是抛光,对金刚石应用具有重要意义。抛光过程中的金刚石摩擦通常发生在室温下。在本文中,通过分子动力学(MD)模拟和设计实验研究了低温(约液氮温度)下的材料去除率。该研究表明,低温对金刚石去除的抑制作用是在纳米尺度范围内控制金刚石材料去除速率的有效方法,并且能够在金刚石抛光中在原子尺度上控制材料去除。
更新日期:2020-04-01
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