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Self‐Regulated Super‐Hydrophobic Cu/CuO Electrode Film Deposited by One‐Step High‐Power Sputtering
Advanced Electronic Materials ( IF 5.3 ) Pub Date : 2019-11-13 , DOI: 10.1002/aelm.201900891 Xiaokai An 1 , Chao Yang 1 , Zhongzhen Wu 1, 2 , Liangliang Liu 2 , Shunning Li 1 , Lin Zhou 1 , Wei Tang 1 , Zhengyong Ma 1 , Zhongcan Wu 1 , Ricky K. Y. Fu 2 , Xiubo Tian 1 , Hai Lin 1 , Feng Pan 1 , Paul K. Chu 2
Advanced Electronic Materials ( IF 5.3 ) Pub Date : 2019-11-13 , DOI: 10.1002/aelm.201900891 Xiaokai An 1 , Chao Yang 1 , Zhongzhen Wu 1, 2 , Liangliang Liu 2 , Shunning Li 1 , Lin Zhou 1 , Wei Tang 1 , Zhengyong Ma 1 , Zhongcan Wu 1 , Ricky K. Y. Fu 2 , Xiubo Tian 1 , Hai Lin 1 , Feng Pan 1 , Paul K. Chu 2
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In spite of advances in integrated circuit technology, dust and corrosion continue to play detrimental roles in electronic and device components such as electrodes and wires, causing possible short circuits and arcing, consequently undermining the long‐time durability of devices. Super‐hydrophobic Cu/CuO films with easy cleaning characteristics and excellent corrosion resistance are prepared by one‐step high‐power magnetron sputtering and tested under high salinity conditions. Self‐regulation of the preferred orientations from Cu (200) to Cu (111) and formation of micro/nano‐rod surface features can be tuned by changing the power density. After exposure for 96 h in air, CuO (111), which has a small surface energy, is produced in situ on the surface of the Cu (111) micro/nano‐rods. Such a super‐hydrophobic surface with a contact angle of 152.5° has attractive properties such as excellent protection against dust particles, easy cleaning, as well as long‐term corrosion resistance compared to conventional Cu metallization films. These results reveal that the Cu/CuO micro/nano‐rod electrode film has great potential in microelectronics, in particular in metal/ceramic circuit boards requiring high power densities and operated in environments with high salinity.
中文翻译：
一步高功率溅射沉积的自调控超疏水Cu / CuO电极膜
尽管集成电路技术取得了进步，但灰尘和腐蚀继续在电子和设备组件（例如电极和电线）中起有害作用，导致可能的短路和电弧，从而破坏了设备的长期耐用性。通过一步大功率磁控溅射制备具有易于清洁特性和优异耐腐蚀性的超疏水性Cu / CuO薄膜，并在高盐度条件下进行了测试。可以通过更改功率密度来调整从Cu（200）到Cu（111）的最佳取向的自我调节以及微/纳米杆表面特征的形成。在空气中暴露96小时后，在铜（111）微米/纳米棒表面上原位产生了表面能较小的CuO（111）。此类超疏水表面的接触角为152。与传统的Cu金属化膜相比，5°具有吸引人的特性，例如出色的防尘颗粒保护，易于清洁以及长期耐腐蚀性能。这些结果表明，Cu / CuO微/纳米棒电极膜在微电子学中具有巨大的潜力，特别是在要求高功率密度并在高盐度环境下运行的金属/陶瓷电路板中。
更新日期：2020-01-13
中文翻译：
一步高功率溅射沉积的自调控超疏水Cu / CuO电极膜
尽管集成电路技术取得了进步，但灰尘和腐蚀继续在电子和设备组件（例如电极和电线）中起有害作用，导致可能的短路和电弧，从而破坏了设备的长期耐用性。通过一步大功率磁控溅射制备具有易于清洁特性和优异耐腐蚀性的超疏水性Cu / CuO薄膜，并在高盐度条件下进行了测试。可以通过更改功率密度来调整从Cu（200）到Cu（111）的最佳取向的自我调节以及微/纳米杆表面特征的形成。在空气中暴露96小时后，在铜（111）微米/纳米棒表面上原位产生了表面能较小的CuO（111）。此类超疏水表面的接触角为152。与传统的Cu金属化膜相比，5°具有吸引人的特性，例如出色的防尘颗粒保护，易于清洁以及长期耐腐蚀性能。这些结果表明，Cu / CuO微/纳米棒电极膜在微电子学中具有巨大的潜力，特别是在要求高功率密度并在高盐度环境下运行的金属/陶瓷电路板中。
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